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Heat Pumps for New Energy & Electronics | HETAPRO
Glowing semiconductor die on a circuit board, the manufacturing environment where 30 to 150 degree process heat decides cell and wafer yield
Applications · New Energy & Electronics

One degree decides the yield.
We deliver that degree.

Lithium battery drying, dry-room regeneration, wafer wet cleaning, hot ultrapure water — the heat that decides whether a cell or a wafer passes, produced at 30–150 °C with no flame. HETAPRO heat pumps take the low-grade heat your process already throws away and put it back where it earns money.

30–150 °CHot water · steam · hot air
6 seriesMatched to each process step
−40 °C dew pointDry-room regeneration heat
24/7 dutyContinuous process operation
Interactive series selector

Set the temperature. The series, the COP and the machine follow.

Choose the temperature your process actually holds — not the nameplate maximum — and the panel returns the matching series, the realistic COP at that lift, the heat source that can feed it, and whether a boiler still has a job. Drag the slider or use the arrow keys. The scale stops at 150 °C because that is the highest temperature any HETAPRO machine delivers. Diffusion, oxidation, LPCVD and epitaxy at 800–1,200 °C are not on it, because no heat pump reaches them and pretending otherwise is how a supplier loses a fab engineer in the first meeting.

30°C 60°C 80°C 95°C 110°C 130°C 150°C
Process temperature
95°C
Anode drying, IPA & calendering

Anode coating, IPA vapour drying, calendering rolls — 80 / 95 °C

Anode coating lines using water-based slurry run 75–110 °C, with the first zones in this band; IPA vapour drying needs 80–100 °C and calendering rolls 80–120 °C. Heat arrives as hot water through an oven coil or a roll circuit, or as hot air where the line was built around a direct-fired heater. This is where a 95 °C water-source machine stops being a utility device and starts carrying process load.

3.4 – 3.9Typical COP
Hot water / hot airDelivery form
Oven exhaust 70–105 °CFeasible heat source
OptionalBoiler still needed?
The six series — click a card to jump the slider

Two industries, one thermodynamic problem

Battery plants and wafer fabs look nothing alike, yet they waste energy in the same shape. Both need heat at a precise temperature, both reject enormous quantities of low-grade heat a few metres away, and both have been trained by decades of cheap gas to solve the first problem by burning fuel and the second by running cooling towers.

The numbers make the case on their own. A cathode coating line holds six or seven drying zones between 85 °C and 130 °C and exhausts air at 70–105 °C. A lithium dry room holds −40 °C dew point by regenerating desiccant at 120–140 °C, and that regeneration alone can be 30–40% of the dry room's energy. A wafer wet bench runs SPM at 120–150 °C and SC-1/SC-2 at 65–85 °C, while the sub-fab chillers reject condenser water at 30–40 °C around the clock.

01

Heat is the yield variable

Oven temperature swings crack electrodes and shift solvent residue. Bath temperature shifts etch rate and particle removal. Precision is not a comfort feature here — it is the process.

02

Heating and cooling at once

Both plants run chillers and heaters on the same day, often in the same room. A water-source heat pump moves that heat instead of buying it twice.

03

Scope 2 is now audited

Battery customers audit their suppliers' carbon intensity; fabs report to their own customers. On-site combustion is the easiest line item to delete.

04

The waste heat is already there

Oven exhaust, chiller condensers, wet-bench overflow, CDA compressor heat. None of it needs to be generated — only lifted.

How to read this page Every process below is listed with its actual working temperature and the form of heat it needs — hot water, steam or hot air. Where a heat pump cannot serve a step, the page says so and explains why. An application page that claims everything is an application page nobody believes.
Process index

Eighteen process steps, band by band

The selector above answers one question — what series does this temperature need. This index answers the other: which process steps actually sit in each band, across both industries. Filter by band, or read the whole list.

Slurry mixing & storageBattery
Temp20–35 °C· chilled water, tight control
SeriesMT-W2W, simultaneous chilled water
Anode coating drying (water-based)Battery
Temp75–110 °C· hot air through oven coil
SeriesHT-A2W · HT-W2S
Cathode coating drying (NMP)Battery
Temp85–130 °C· 6–7 zones, exhaust 70–105 °C
SeriesHT-A2W · HT-W2S
Calendering roll heatingBattery
Temp80–120 °C· hot water or hot oil circuit
SeriesHT-A2W via heat exchanger
Vacuum bake / cell dryingBattery
Temp85–120 °C· hot water jacket, 8–24 h cycles
SeriesMT-W2W · HT-A2W
NMP recovery reboilerBattery
Temp100–130 °C· low-pressure steam
SeriesHT-W2S · HT-A2S
Dry-room desiccant regenerationBattery
Temp120–140 °C· regeneration air, −40 °C dew point
SeriesHT-W2S · HT-A2W
Formation & ageing chambersBattery
Temp25–45 °C· cooling-dominated, heat rejected
SeriesMT-W2W recovering chamber heat
Module & pack adhesive curingBattery
Temp60–80 °C· hot air, low velocity
SeriesMT-A2A · MT-A2W
SPM / photoresist strip bathSemiconductor
Temp120–150 °C· hot water or steam, isolated loop
SeriesHT-W2S · HT-A2W
SC-1 (APM) particle removalSemiconductor
Temp65–80 °C· hot water via double-wall exchanger
SeriesMT-A2W · MT-W2W
SC-2 (HPM) metal removalSemiconductor
Temp65–85 °C· hot water, corrosion-resistant wetted parts
SeriesMT-W2W · HT-A2W
Hot DI / UPW rinseSemiconductor
Temp60–90 °C· hot ultrapure water loop
SeriesMT-W2W · HT-A2W
IPA vapour dryingSemiconductor
Temp80–100 °C· hot water or hot nitrogen
SeriesMT-W2W · HT-A2W
Post-CMP cleanSemiconductor
Temp60–80 °C· hot water, slurry preheat
SeriesMT-A2W · MT-W2W
Plating & electroplating bathsSemiconductor
Temp40–60 °C· hot water + simultaneous cooling
SeriesMT-W2W, heating and cooling
Cleanroom make-up air reheatSemiconductor
Temp18–25 °C· large air volume, small ΔT
SeriesMT-W2W from chiller condensers
Sub-fab chiller condenser loopSemiconductor
Source30–40 °C· lifted to 80–90 °C hot water
SeriesMT-W2W · HT-A2W
Showing 18 processes across both industries.

Lithium battery manufacturing

Cell production is a drying business with a coating problem attached. Moisture and solvent have to leave the electrode at a controlled rate; later, moisture has to be kept out of the cell entirely. Both jobs are heat jobs, and both are usually served by gas burners whose exhaust is then thrown away.

Mixing 20–35 °C · cool Coating & drying 85–130 °C air exhaust 70–105 °C Calendering 80–120 °C roll Slitting dry air, RH < 1% Dry room assembly −40 °C dew point regen 120–140 °C Vacuum bake 85–120 °C jacket 8–24 h cycle Formation 25–45 °C Heat demand follows the electrode from slurry to sealed cell — and so does the waste heat Recover the exhaust, not the ambient air 70–105 °C oven exhaust and 30–40 °C utility water are the heat sources that make the COP work
Figure 1. The five thermal steps that dominate cell manufacturing. Red boxes mark the two steps where drying quality directly sets yield — coating and dry-room assembly.
Battery process heat map. Temperatures are typical operating windows for Li-ion cell production; actual setpoints follow the chemistry, binder system and line speed.
Process stepWorking temp.Heat formSeriesWhy it matters
Cathode coating drying85–130 °CHot air, 6–7 zonesHT-A2W · HT-W2SNMP evaporates here; zone temperature sets adhesion and residue
Anode coating drying75–110 °CHot airHT-A2WWater-based slurry, higher air volume, lower temperature
Calendering80–120 °CHot water / hot oil rollHT-A2WRoll temperature sets electrode density uniformity
Dry-room regeneration120–140 °CRegeneration airHT-W2S · HT-A2WHolds −40 °C dew point at 20–25 °C; 30–40% of dry-room energy
Vacuum bake85–120 °CHot water jacketMT-W2W · HT-A2W8–24 h cycles; moisture left here becomes HF later
NMP recovery100–130 °CLow-pressure steamHT-W2S · HT-A2SDistillation reboiler duty; NMP boils at 202 °C at ambient pressure
Formation & ageing25–45 °CCooling + trim heatMT-W2WChambers reject heat continuously — a free source for the loops above
Electrolyte filling18–25 °C, ≤ −40 °C DPDry airDry-room systemElectrolyte is moisture-critical; no direct heat pump contact

Coating drying and NMP: the biggest single load

Electrode drying is usually described as an oven problem, but it is really an energy-recovery problem. Cathode lines hold 85–130 °C across six or seven zones and exhaust 70–105 °C air saturated with NMP. That exhaust is hot enough to be a heat source and dirty enough that most plants simply vent it to the recovery unit and then to atmosphere.

The architecture that works is a bypass, not a rebuild. Exhaust is drawn off after particulate filtration, passes through the heat pump evaporator, and returns as 85–130 °C supply air to the oven. The oven's internal ducting, zone control logic and original burner stay exactly where they are — the heat pump becomes the base-load heat source and the burner becomes backup, switching in on demand or on fault.

What the numbers look like

NMP boils at 202 °C with a latent heat around 540 kJ/kg. Cathode drying typically runs 85–130 °C; anode (water-based) runs 75–110 °C. Exhaust leaves at 70–105 °C. Industry estimates put coating and drying at roughly half to two-thirds of a cell plant's energy demand — which is why this single loop decides the plant's energy bill.

Why recovering exhaust beats air-source

An air-source unit lifting ambient air to 120 °C works hard for every degree. A unit lifting 90 °C exhaust to 120 °C works across a much smaller span, so the same compressor delivers far more heat. Cascade systems lifting 50–70 °C waste heat to 120–150 °C typically land at COP 2.5–3.5; air-source units at 80–95 °C reach 3.5–4.8 on vendor data. Treat both as indicative, not guaranteed.

Safety boundary — NMP exhaust NMP vapour is flammable and its exhaust stream carries solvent aerosol and electrode dust. A standard heat pump is not acceptable here. The exhaust path needs ATEX / IECEx-rated components, particulate filtration upstream of the coil, continuous LEL monitoring and interlocks that trip the unit on high concentration. Where the zone classification cannot be resolved, the correct design is an indirect water loop: exhaust heats water, water heats the heat pump, and the refrigerant never sees solvent.

Dry rooms: the load nobody budgets for

A lithium dry room is not air-conditioning. It holds −40 °C dew point, 20–25 °C and below 1% relative humidity, because a few milligrams of moisture in a sealed cell will generate hydrofluoric acid and end the cell's life. Refrigeration alone cannot reach that dew point — desiccant wheels do, and wheels are regenerated with hot air.

Conventional wheels need 120–140 °C regeneration air. That is squarely inside HETAPRO's range: HT-W2S produces 110–150 °C steam, HT-A2W produces 135 °C hot water for a regeneration coil. Mid-temperature wheels, now used in volume production, regenerate at 70–90 °C — low enough for MT-W2W hot water and low enough to use recovered chiller heat instead of a dedicated heater.

Dry-room regeneration options. Wheel technology decides which heat source you need — check this before sizing the heat pump.
Wheel typeRegeneration temp.Best heat sourceTrade-off
Conventional silica gel / molecular sieve120–140 °CHT-W2S steam · HT-A2W 135 °C waterProven at −40 to −60 °C; higher-grade heat, lower COP
Mid-temperature regeneration wheel70–90 °CMT-W2W water · recovered chiller heatHigher COP and cheaper heat, but needs wheel selection from the start
Two-stage wheel train80–110 °C / 90–135 °CHT-A2W + MT-W2W combinationReaches −50 to −60 °C for electrolyte and formation areas

Vacuum bake and calendering: the quiet loads

Vacuum bake runs 85–120 °C for 8–24 hours per cycle, often across dozens of chambers, and it is a pure hot-water jacket load — no air, no steam, no complexity. Calendering is the same story at 80–120 °C on the roll. Neither is glamorous, both run continuously, and both are trivially served by 95 °C or 135 °C hot water from a unit that is already recovering heat elsewhere in the plant.

Semiconductor wafer processing

A fab's thermal problem is the mirror image of a battery plant's. The process temperatures are lower — mostly 60–150 °C — but the purity requirements are extreme, the uptime requirement is absolute, and the waste heat is enormous and continuous. A fab that gets its hot water from a gas boiler while its chillers reject 30–40 °C water to cooling towers is burning money in both directions at once.

Sub-fab chillers Process cooling, 5–12 °C supply Condenser water 30–40 °C Rejected to towers today Wet bench effluent Overflow and rinse water 25–40 °C Continuous, 24/7 HETAPRO heat pump MT-W2W / HT-A2W Evaporator ← 30–40 °C Condenser → 80–90 °C Simultaneous chilled water 5–12 °C, cooling side SC-1 / SC-2 baths 65–85 °C hot water ±1 °C bath stability Hot UPW / DI rinse 60–90 °C, isolated loop 316L EP / PFA wetted Cleanroom MAU reheat 18–25 °C after dehumidification large volume, small ΔT One loop, two useful outputs: hot water where the process needs it, chilled water where the chillers used to make it twice SPM at 120–150 °C sits outside this loop: it is served separately by HT-W2S steam through a quartz or PFA bath.
Figure 2. The fab heat-recovery loop. Most of the heat a fab needs below 100 °C is already inside the building, rejected by the chillers that keep the process cool.
Wafer wet-process heat map. SPM is the only routine step that needs steam; everything else sits in hot-water territory.
ProcessWorking temp.Heat formSeriesConstraint
SPM / piranha strip120–150 °CSteam or 135 °C water via HXHT-W2S · HT-A2WQuartz / PFA bath, no metal contact
SC-1 (APM)65–80 °CHot water, double-wall HXMT-A2W · MT-W2WAmmonia chemistry, venting
SC-2 (HPM)65–85 °CHot waterMT-W2W · HT-A2WHCl chemistry, corrosion allowance
Hot DI / UPW rinse60–90 °CHot UPW loopMT-W2WNo copper or brass wetted parts
IPA vapour drying80–100 °CHot water / hot N₂MT-W2W · HT-A2WSolvent zone, Ex rating
Post-CMP clean60–80 °CHot waterMT-A2WSlurry preheat also possible
Plating baths40–60 °CHot water + coolingMT-W2WSimultaneous cold for rectifier cooling
Cleanroom MAU reheat18–25 °CHot water coilMT-W2WHuge air volume, tiny ΔT — recovery essential

Purity is the real engineering problem

Nobody in a fab cares that a heat pump can reach 90 °C. They care whether it can reach 90 °C without putting a single metal ion into the water. That constraint reshapes the whole system: the refrigerant circuit stays entirely outside the process, heat crosses a double-wall exchanger with a monitored intermediate loop, and every wetted surface is 316L stainless (EP where required), high-purity PFA or quartz-compatible material.

Non-negotiable design rules for fabs 1. No copper, brass or aluminium wetted parts anywhere in the hot water loop. 2. Double-wall heat exchanger with leak detection on the intermediate circuit — a refrigerant leak must never be able to reach UPW. 3. Hot UPW returned through PFA or 316L EP piping with no stagnant branches. 4. Unit placed outside the cleanroom envelope (sub-fab or roof), with vibration isolation and drip containment. 5. N+1 redundancy on any loop feeding a wet bench — a heat pump trip must not stop a bath mid-process.

The heat recovery prize: chillers that heat the fab

Semiconductor fabs run chillers year-round to hold process cooling at 5–12 °C, and reject the condenser heat at 30–40 °C. At the same time they buy heat to hold baths at 65–85 °C, hot UPW at 60–90 °C and cleanroom make-up air at 18–25 °C. That is a heat pump's ideal case: a warm, constant source and a nearby sink, with a lift of only 40–50 K.

Because the unit cools as it heats, the chilled water it produces can go back to the process cooling loop. System COPs of 4–6 are realistic for this configuration because you are effectively paid twice — once for the heat delivered, once for the chiller load avoided. It is the single highest-value heat pump project available in most fabs, and it is usually blocked not by thermodynamics but by the fact that the chiller plant and the hot water plant are owned by two different teams.

Beyond the two flagships

The same process physics appears across new energy and electronics manufacturing. None of these needs a different product family — they need a different load calculation.

PV cell wet processing

Texturing and cleaning baths at 70–85 °C, hot DI rinse and emitter-wash steps. High volume, continuous, and a natural fit for 95 °C hot water.

ESS pack & module testing

Thermal chambers cycling 25–45 °C reject heat continuously; recovered condenser heat can preheat the next chamber or the plant's hot water.

Composite & blade curing

Mould and oven heating at 40–90 °C for resin cure, with post-cure above 120 °C where the heat pump hands over to electric.

PCB & display wet lines

Desmear at 70–80 °C, plating baths at 40–60 °C, hot-air knife drying at 70–85 °C — low temperature, high uptime, fast payback.

Product match

Six series, matched to process step

Battery drying and wafer wet processing use four of the six families. The two steam units matter more here than in any other industry we serve, because dry-room regeneration and SPM stripping both need heat above 110 °C. The cards outlined in red follow the temperature band currently selected in the selector above — change the slider and the recommendation changes with it.

95 °C hot water · air source
MT-A2W air source 95°C hot water scroll heat pump unit

SC-1/SC-2 baths, post-CMP clean, general hot water where no waste heat source is available.

95 °CMax. water
350 kWTypical output
ScrollCompressor
AirHeat source
MT-A2W product page →
95 °C hot water · water source
MT-W2W water source 95°C hot water screw heat pump unit

The workhorse for fab heat recovery and battery vacuum bake: chiller condensers and wet-bench effluent become the heat source.

95 °CMax. water
1,500 kWTypical output
Screw + VFDCompressor
WaterHeat source
MT-W2W product page →
135 °C hot water · air source
HT-A2W air source 135°C hot water piston heat pump unit

Coating oven coils at 120–130 °C, calendering rolls, vacuum bake, dry-room regeneration coils.

135 °CMax. water
220 kWTypical output
PistonCompressor
AirHeat source
HT-A2W product page →
110–150 °C steam · water source
HT-W2S water source 150°C steam heat pump unit

SPM baths, NMP recovery reboilers and conventional dry-room regeneration where 120–140 °C air is required.

150 °CSteam
110–150 °CRange
ScrewCompressor
WaterHeat source
HT-W2S product page →
110–150 °C steam · air source
HT-A2S air source 150°C steam heat pump unit

Where no water-side waste heat exists but steam is still needed — retrofits with only oven exhaust available.

150 °CSteam
110–150 °CRange
PistonCompressor
AirHeat source
HT-A2S product page →
30–85 °C hot air · inverter dryer
MT-A2A air source inverter hot air heat pump dryer

Adhesive curing, low-temperature module drying and component bake-out below 85 °C. Not for electrode ovens — those need 120 °C+.

30–85 °CAir
DirectHeating
InverterCompressor
AirHeat source
MT-A2A product page →
Total cost of ownership

Ten years of heat, priced on your site

Energy price alone does not decide a project — capital, load and running hours do. Set seven numbers and the panel prices both options over ten years, including the capital the boiler option does not need. Screening tool, not a quotation. Every monetary figure stays in whatever currency you enter.

Delivered fuel cost divided by its heating value. Typical industrial band 0.02–0.10.
All-in industrial tariff, with demand charges spread across the kWh.
Well-maintained gas boiler 80–85%; aged plant 70–78%; condensing 90%+.
Synced to the selector above. Override it the moment a supplier gives you a guaranteed figure at your duty point.
Average, not peak. The peak sizes the machine; the average sizes the saving.
Coating lines and dry rooms often run 7,000–8,000 h. Pilot lines and R&D fabs run far fewer — and that is what kills those projects.
Complete system: unit, buffer, hydraulics, controls, installation. Fab integration with UPW isolation runs higher.
Ten-year cost, heat pump vs boiler —
Boiler — cost per kWh of heat—
Heat pump — cost per kWh of heat—
Break-even COP at your prices—
Annual heat delivered—
Annual energy-cost saving—
Simple payback on installed cost—
Boiler · 10 years of energy—
Heat pump · 10 years incl. capital—
—

All monetary outputs are in whatever currency you enter. This is a screening estimate, not a quotation — the exclusions are listed directly below.

What this TCO includes — and what it deliberately leaves out

Included: the installed cost of the heat pump system and ten years of energy cost for both options at constant prices. Excluded, and all of it favours the heat pump: avoided boiler servicing and burner maintenance, NOx permit and stack testing, fuel storage and handling, carbon price or Scope 1 reporting cost, any grant or tax credit, and the value of the chilled water produced when the unit runs as a heat recovery chiller. Excluded, and this works against it: electrical capacity upgrades, structural or footprint works, and production downtime during tie-in. The three formulas are the same ones used on our textile and food pages: boiler heat cost = fuel ÷ efficiency, heat pump heat cost = electricity ÷ COP, break-even COP = electricity ÷ boiler heat cost.

Where a heat pump stops — and what to do instead

An application page without limits is a brochure. These are the four boundaries we hit in every new energy and electronics project, stated before you ask.

The honest boundaries. None of these is a product weakness; they are thermodynamic or contamination facts.
BoundaryWhyCorrect solution
Diffusion, oxidation, LPCVD, PECVD, epitaxy800–1,200 °C process temperatures — two orders of magnitude beyond any heat pumpElectric furnaces and RF heating; heat pump serves only the utility loop around them
Direct steam injection into process chemistryWould introduce contaminants into SPM, SC-1 or UPW; defeats the entire purity chainNever. Isolated secondary loop with double-wall exchanger only
Flammable solvent exhaust (NMP)Standard units are not Ex-rated; a spark in the exhaust path is unacceptableATEX-rated equipment plus LEL monitoring, or an indirect water loop
Ovens needing >150 °C at high velocityAbove 150 °C the cascade loses its advantage; some high-speed lines need 160–180 °C airHybrid: heat pump to 150 °C, electric trim heater for the last 10–30 K
Processes with very low annual hoursCapital recovery depends on running hours; pilot lines and R&D fabs rarely justify itStart with the utility loop (hot water/UPW) and expand as utilisation rises

Standards and compliance

Equipment entering a battery plant or a fab is audited against a specific set of rules. These are the ones that come up in every project review.

Semiconductor environment

SEMI S2 environmental, health and safety for production equipment; SEMI F47 voltage-sag ride-through; SEMI F57 high-purity polymer piping where PFA is used; ISO 14644-1 cleanroom classification for the installation envelope; NFPA 70 / UL 508A for control panels.

Battery plant & solvent zones

ATEX / IECEx for NMP-bearing exhaust and solvent areas; IATF 16949 quality system expectations from automotive customers; GB 51377 lithium battery plant design code for Chinese projects; EN 378 / F-Gas 517/2014 for refrigerant selection and leak management.

What we need to size your system

No site visit is needed for a first-pass answer. Five numbers get you an indicative design, a COP range and a payback estimate.

  1. Process temperature levels

    Supply and return temperature for each loop — for example "oven supply 125 °C, return 95 °C" or "bath 80 °C, return 70 °C".

  2. Heat load and load profile

    Peak kW plus annual operating hours, and whether the load is continuous (dry room, UPW) or batch (vacuum bake, SPM).

  3. Available waste heat

    Source type, temperature and flow: oven exhaust at 70–105 °C, chiller condenser water at 30–40 °C, wet-bench effluent at 25–40 °C.

  4. Current cost of heat

    Fuel type, price per unit, boiler efficiency, and the electricity tariff including demand charges and time-of-use structure.

  5. Site constraints

    Available footprint (roof, sub-fab, utility yard), noise limits, redundancy requirement, and whether the area is classified.

Recoverable heat from an air stream
Q (kW) ≈ 0.335 × V (m³/h) × ΔT (K) / 1000
Example: 20,000 m³/h of oven exhaust cooled from 95 °C to 45 °C → 0.335 × 20,000 × 50 / 1000 ≈ 335 kW of recovered heat, before the compressor lift is added.
What this page does not claim COP and payback figures on this page are indicative ranges drawn from published system data and our own project experience — not guaranteed performance. Actual results depend on the lift temperature, hours of operation and local tariffs. We will put a specific number against your specific numbers, in writing, before you commit to anything.

FAQ

Can a heat pump really supply 130 °C air for battery electrode drying?
Yes, with the right series. Cathode coating lines typically run 85–130 °C supply air and anode lines 75–110 °C. HT-A2W delivers 135 °C hot water that heats the oven coil, and HT-W2S delivers 110–150 °C steam for lines originally designed around a steam coil. The heat source is normally the oven's own exhaust at 70–105 °C, not ambient air — which is what keeps the COP high.
What dew point can you hold in a lithium battery dry room?
Dry rooms for electrode and electrolyte areas are typically held at −40 °C dew point, 20–25 °C and below 1% RH. The heat pump does not dehumidify directly; it supplies the 120–140 °C regeneration air for conventional desiccant wheels, or 80–90 °C hot water where mid-temperature regeneration wheels are used. Regeneration is usually 30–40% of the dry room's energy consumption, which is why the heat source matters more than the unit's nameplate COP.
Does the heat pump touch the chemicals or the ultrapure water?
No. The refrigerant circuit never contacts process fluids. Heat crosses an isolated secondary loop and a double-wall heat exchanger, with wetted parts in 316L stainless steel, high-purity PFA or equivalent. In a fab this is a hard requirement: no copper or brass wetted surfaces, no path by which refrigerant could reach UPW, and leak detection on the intermediate loop.
What about the 800–1200 °C furnace steps in a wafer fab?
Those stay electric. Diffusion, oxidation, LPCVD, PECVD and epitaxy run far above any heat pump's reach, and we do not pretend otherwise. The heat pump's territory is wet processing, hot UPW, bath heating, IPA drying, cleanroom reheat and heat recovery from the sub-fab chiller loop — which is where most of the low-grade energy in a fab is actually wasted.
Is NMP-laden exhaust safe for a heat pump?
Only with an engineered approach. NMP exhaust passes through particulate filtration first; the heat exchanger and electrical equipment in the exhaust path must be rated for the solvent zone (ATEX / IECEx), with NMP concentration kept well below the lower explosive limit and monitored continuously. Where the zone classification cannot be met, an indirect water loop between exhaust and heat pump is the safer architecture.
How fast does a project pay back?
Three numbers decide it: heat load, annual operating hours, and the gap between your current cost of heat and your electricity price. Coating lines and dry rooms run thousands of hours a year at high load, so they sit at the favourable end of the range. Send us the three numbers and we will return an indicative COP and payback range rather than a generic claim.

Send us three numbers. Get a real answer.

Process temperature, annual heat demand, and what you pay for heat today. That is enough for an indicative COP, a recommended series and a payback range — with the boundaries stated, not hidden.

Talk to our engineers Back to the process index

Sources and basis

  • Coating drying windows (cathode 85–130 °C, anode 75–110 °C, exhaust 70–105 °C): lithium battery plant environmental impact assessments and coating-line specifications published 2023–2025.
  • NMP properties (boiling point 202 °C, latent heat ≈540 kJ/kg): solvent property data and NMP recovery system literature.
  • Dry-room conditions (−40 °C dew point, 20–25 °C, <1% RH) and regeneration temperatures (120–140 °C conventional, 70–90 °C mid-temperature wheels): desiccant dehumidifier specifications and published dry-room system data; mid-temperature regeneration performance reported by wheel manufacturers.
  • SPM 120–150 °C, SC-1 65–80 °C, SC-2 65–85 °C, hot DI 60–70 °C: wet-bench process standards and RCA clean literature (SIMIT, patent filings, university fab operating standards).
  • Cleanroom 20–25 °C, ±0.5–1 °C control: semiconductor HVAC design references.
  • COP ranges: published cascade and water-source heat pump system data for 120–150 °C and 80–95 °C duty; treated as indicative, not guaranteed.

HETAPRO — Industrial high-temperature heat pumps: hot water to 95–135 °C, steam to 150 °C, drying air 30–85 °C.

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© 2026 HETAPRO. Specifications subject to change. Figures on this page are engineering guidance, not contractual performance data.

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